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BDN18-6CB/A01

HEATSINK CPU W/ADHESIVE 1.81"SQ | CTS Thermal Management Products
Fiyat Aralığı
$4,13000 - $7,41600
Fiyatlar 3 tedarikçiden derlenmiştir. KDV hariçtir. Miktara göre değişiklik gösterebilir.

Collecting offers...

TedarikçiStokMinFiyatTeslimatGüncellendiAdetİşlem
Future Electronics
02000
$4,24000 (Min: 2000)
3 - 419 Aralık 2025 08:31Stokta Yok
Arrow
003 - 4Pending refreshStokta Yok
Mouser
391
$6,18000 (Min: 1)
$5,47000 (Min: 10)
$4,45000 (Min: 500)
$4,36000 (Min: 1000)
$4,13000 (Min: 2000)
$5,22000 (Min: 25)
$5,04000 (Min: 50)
$4,85000 (Min: 100)
$4,59000 (Min: 250)
Daha fazla göster
3 - 419 Aralık 2025 08:31Ekle
Farnell
003 - 4Pending refreshStokta Yok
TME
003 - 4Pending refreshStokta Yok
Digi-Key
37030
$7,41600 (Min: 1)
$6,56400 (Min: 10)
$6,25248 (Min: 25)
$6,02664 (Min: 50)
$5,80872 (Min: 100)
$5,53238 (Min: 250)
$5,33186 (Min: 500)
$4,95176 (Min: 2000)
Daha fazla göster
23 hafta08 Aralık 2025 19:30Ekle
Genel Bakış
Dokümanlar

Ürün Açıklaması

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Özellikler

  • Type: Top Mount
  • Shape: Square, Pin Fins
  • Width: 1.810" (45.97mm)
  • Length: 1.810" (45.97mm)
  • Diameter: -
  • Material: Aluminum
  • Fin Height: 0.605" (15.37mm)
  • Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
  • Material Finish: Black Anodized
  • Attachment Method: Thermal Tape, Adhesive (Included)
  • Thermal Resistance @ Natural: 8.10°C/W
  • Power Dissipation @ Temperature Rise: -
  • Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 400 LFM