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NC191LTA10

SMOOTH FLOW LOW TEMP SOLDER PAST | Chip Quik Inc.
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Product Description

No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Syringe, 0.35 oz (10g), 3cc

Features

  • Form: Syringe, 0.35 oz (10g), 3cc
  • Type: Solder Paste
  • Process: -
  • Diameter: -
  • Flux Type: No-Clean
  • Mesh Type: 4
  • Shelf Life: 12 Months
  • Wire Gauge: -
  • Composition: Bi57Sn42Ag1 (57/42/1)
  • Melting Point: 279°F (137°C)
  • Shelf Life Start: Date of Manufacture
  • Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)