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TS391LT

THERMALLY STABLE SOLDER PASTE NO | Chip Quik Inc.
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Product Description

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc

Features

  • Form: Syringe, 0.53 oz (15g), 5cc
  • Type: Solder Paste
  • Process: Lead Free
  • Diameter: -
  • Flux Type: No-Clean
  • Mesh Type: 4
  • Shelf Life: 12 Months
  • Wire Gauge: -
  • Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
  • Melting Point: 281°F (138°C)
  • Shelf Life Start: Date of Manufacture
  • Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)