Product Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc
Features
- Form: Syringe, 1.23 oz (35g), 10cc
- Type: Solder Paste
- Process: Lead Free
- Diameter: -
- Flux Type: No-Clean
- Mesh Type: 3
- Shelf Life: 6 Months
- Wire Gauge: -
- Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Point: 423 ~ 424°F (217 ~ 218°C)
- Shelf Life Start: Date of Manufacture
- Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
