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NC2SWLF.031 1LB

LF SOLDER WIRE 99.3/0.7 TIN/COPP | Chip Quik Inc.
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Product Description

Lead Free No-Clean Wire Solder Sn99.3Cu0.7 (99.3/0.7) 20 AWG, 21 SWG Spool, 1 lb (454 g)

Features

  • Form: Spool, 1 lb (454 g)
  • Type: Wire Solder
  • Process: Lead Free
  • Diameter: 0.031" (0.79mm)
  • Flux Type: No-Clean
  • Shelf Life: -
  • Wire Gauge: 20 AWG, 21 SWG
  • Composition: Sn99.3Cu0.7 (99.3/0.7)
  • Melting Point: 441°F (227°C)
  • Shelf Life Start: -
  • Storage/Refrigeration Temperature: -