Product Description
Lead Free No-Clean Wire Solder Sn99.3Cu0.7 (99.3/0.7) 20 AWG, 21 SWG Spool, 1 lb (454 g)
Features
- Form: Spool, 1 lb (454 g)
- Type: Wire Solder
- Process: Lead Free
- Diameter: 0.031" (0.79mm)
- Flux Type: No-Clean
- Shelf Life: -
- Wire Gauge: 20 AWG, 21 SWG
- Composition: Sn99.3Cu0.7 (99.3/0.7)
- Melting Point: 441°F (227°C)
- Shelf Life Start: -
- Storage/Refrigeration Temperature: -