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BDN10-3CB/A01

HEATSINK CPU W/ADHESIVE 1.01"SQ | CTS Thermal Management Products
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Product Description

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Features

  • Type: Top Mount
  • Shape: Square, Pin Fins
  • Width: 1.010" (25.65mm)
  • Length: 1.010" (25.65mm)
  • Diameter: -
  • Material: Aluminum
  • Fin Height: 0.355" (9.02mm)
  • Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
  • Material Finish: Black Anodized
  • Attachment Method: Thermal Tape, Adhesive (Included)
  • Thermal Resistance @ Natural: 26.40°C/W
  • Power Dissipation @ Temperature Rise: -
  • Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM